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09/07 MicroNanoReliability Congress, Berlin, Germany More Information ...: Congress Homepage   "TSV constraints related to temperature excursion, pressure during moulding and materials used" - Presentation of FEM studies on Through-Silicon Via design and process constraints related to package molding by T. Fałat and K. Friedel from Wrocław University of Technology, Poland - Sept. 2-5, 2007 (Berlin, Germany)
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