DAVID index TECHNOLOGIES

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DAVID Technologies		The main focus of the key technologies developed in the DAVID project lies on inertial sensor systems. Basically, these devices measure translational acceleration or rotational velocities by inertial effects on an elastically suspended proof mass. Other "Micro Electro-Mechanical Systems" (MEMS) like RF-switches will equally profit from the DAVID results. Inertial sensors have specific requirements regarding their ambient pressure: While a relatively high damping is necessary for accelerometers, a resonant sensor like a gyroscope can only work at very low pressures (<0.1 mbar). Ambient control in chip-scale sensor systems is therefore one of the major challenges of the DAVID project, involving hermetic bonding processes, advanced thin-film getter technology and lifetime reliability prediction methods.



MEMS Integration Micro-Electromechanical Systems (MEMS) combine tiny mechanical elements with complex electronic circuits to open a vast field of new applications. Further Information Nanoliter Vacuum Packaging The cavity in a waferlevel package is extremely small - vacuum technology in this dimension is a true novelty and incontournable for realizing many kinds of microsystems.	Wafer-to-Wafer stacking Waferbonding equipment is largely available for many different process types. Using it for hybrid MEMS/ASIC integration leads one step forward... and has the potential to improve system quality and costs dramatically. Chip-to-Wafer integration Although Chip-to-Wafer (C2W) bonding may be a risky approach from today's point of view, it can be an interesting alternative to waferbonding in terms of supplier and technology independence.	Through-Silicon Vias Unlimited chip stacking requires signal routing in three dimensions. In contrast to logic circuits, ultra-thin silicon is not the preferred base for MEMS system packaging. Wafer Molding The short cycle times of transfer molding, combined with full wafer processing: Will this be the ultimate packaging solution? Today's available materials show limitations to overcome by specific formulations and an advanced process design.